The RDHx liquid-cooled backplane is an advanced heat dissipation solution for data centers and high-density computing power scenarios. Through direct-contact liquid cooling technology, the coolant is introduced into the server backplane to accurately absorb the heat from core components such as chips, significantly improving the heat dissipation efficiency. Compared with traditional air cooling, its heat conduction efficiency is increased by over 90%, and a single cabinet can support a heat dissipation requirement of over 50kW. At the same time, it reduces energy consumption and noise by approximately 30%, and is suitable for high-heat-density scenarios such as AI servers and edge computing. 

This product adopts a modular design, is compatible with mainstream server architectures, and supports rapid deployment and flexible expansion. Its closed-loop circulation system reduces environmental dependence. Combined with an intelligent temperature control algorithm, it can dynamically adjust the coolant flow rate and temperature to ensure the long-term stable operation of the equipment. The RDHx liquid-cooled backplane not only helps data centers achieve PUE optimization but also provides reliable technical support for low-carbon and high-computing-power demand scenarios. It is a key component of the next-generation green computing power infrastructure.